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Company : Tianjin Hengji Int'l Trade Co., Ltd
Address : No.2-2-1103 Shuixiyuan Zhongbei Town Xiqing Dist. Tianjin China
E-mail : tj_hengji@163.com/ tj_hengji@hotmail.com
Website : www.tianjinhengji.com
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Contact Person: Linda
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Quantity :
PI film base coverlay sheet
Features
● Suitable for both traditional
● Superior dimensional stability
● Excellent electrical, chemical and thermal property
● Resin float well controlled and be good for FPC lamination
● Excellent cover power, light of
★Product structure
|
Model |
TH1315 |
TH1325 |
TH2525 |
TH5025 |
重量占比 Weight ratio |
|
Structure |
Release paper |
Release paper |
Release paper |
Release paper |
37% |
|
Adhesives |
Adhesives |
Adhesives |
Adhesives |
21% |
|
|
PI film |
PI film |
PI film |
PI film |
42% |
★Normal Product Size＆Thickness
|
Specification |
PI film |
Adhesive |
Release Paper |
Total |
Supply Size |
|
TH1315 |
12.5um |
15um |
110um |
137.5um |
W:250/500±0.5mm L:200±1m 100±1m |
|
TH1325 |
12.5um |
25um |
110um |
147.5um |
|
|
TH2525 |
25um |
25um |
110um |
160um |
|
|
TH5025 |
50um |
25um |
110um |
185um |
★Performance Sheet
|
Items |
Units |
Conditioning |
Typical Value |
Test method |
Standard |
|
|
TH1315/1325 |
TH2525/5025 |
|||||
|
Resin Flow |
um |
A |
≦0.13 |
≦0.13 |
IPC-TM-650 2.3.17.1 |
≦0.2 |
|
Dimension Stability |
TD % |
|
0.103 |
0.113 |
IPC-TM-650 2.2.4 |
≦±0.15 |
|
MD % |
|
-0.091 |
-0.105 |
|||
|
Heat Resistance |
/ |
300℃ 10sec |
OK |
OK |
IPC-TM-650 2.4.13 |
No change in Appearance |
|
Peel Strength |
Kfg/cm (90°) |
After lamination |
0.8 ~1.2 |
0.9~1.5 |
IPC-TM-650 2.4.9 |
≧0.8 |
|
Surface resistance |
Ω |
|
1.1×1011 |
IPC-TM-650 2.5.17 |
≧1010 |
|
Note: 1.Testing Peel strength 、soider Resistance and Resin flow with Coverlay pressed on smooth copper
2.Date shown above are nominal values for reference only,Details see Certification of Quality.
★ Storage Condition
Vacuum Packaging below 30℃,below70%RH for 6 months
1. Lamination
1.1Fast Lamination: first pre-press, nextforming-press
1.1.1 Pre-press: Temp: T 180℃
Pressure: P 0
Time: 0~t1: 10sec
1.1.2 Forming-press: Temp: T 180℃
Pressure: P 35Kgf/cm2
Time: t1~t2: 100sec
2 Curing: 160℃ for 60min
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